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ssss1 is a collection of chapters on reliability science. It begins with a chapter on irreversible processes of atomic flow, heat flow, and charge flow in open systems. The most important issue of Joule heating will be analyzed. The topics of electromigration, thermomigration, stress migration, and failure analysis will be covered. Equations of mean‐time‐to‐failure (MTTF) will be reanalyzed on the basis of entropy production.

Finally, in ssss1, a brief discussion on how to use artificial intelligence to accelerate reliability testing will be presented. We propose an x‐ray based graphic processing unit (X‐GPU) to analyze early reliability failure before it occurs in any newly developed 3D IC device for mass production. The goal of AI here is to change the time‐dependent and time‐consuming reliability tests to time‐independent tests. The basic idea of mean microstructure‐change to failure (MMTF) will be introduced, so that we can link MTTF to MMTF.

We appreciate the capable help of Mrs. Jody Lee and Mr. John Wu at NCTU in preparing the book.