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Part III is a collection of chapters on reliability science. It begins with a chapter on irreversible processes of atomic flow, heat flow, and charge flow in interconnects. The topics of electromigration, thermomigration, stress migration, and failure analysis will be covered. The topic of men‐time‐to‐failure (MTTF) will be reviewed on the basis of entropy production.

In the last chapter, ssss1, a discussion on how to use AI to accelerate the solving of reliability problems will be explored. We propose an X‐ray‐based graphic processing unit (X‐GPU) to analyze reliability failure distribution in any newly developed 3D IC device for mass production. The goal is to change the time‐dependent and time‐consuming reliability tests to time‐independent tests.

1 1 Chen, K.‐N. and Tu, K.N. (2015). Materials challenges in three‐dimensional integrated circuits. MRS Bulletin 40: 219–222.

2 2 Iyer, S. (2015). Three‐dimensional integration: an industry perspective. MRS Bulletin 40: 225–232.