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While the cost of production of 3D IC can be reduced when it is in mass production, the problem of reliability due to over‐heating has to be solved fundamentally by a smart system design or by design‐for‐reliability (DfR) and by a critical selection in materials integration. To put it simply, we need to design low‐power devices, and also we need to understand heat production (Joule heating) in irreversible processes and heat dissipation in the device structure. [6] Hence, the science and engineering of electronic packaging come into focus.

Entropy production is the most relevant understanding of failure induced by electromigration, thermomigration, and stress‐migration in irreversible processes. [7] Statistical analysis of failure requires the knowing of mean‐time‐to‐failure (MTTF). An example is Black’s equation of MTTF for elctromigration. In ssss1, we shall present a unified model of MTTF for electromigration, thermomigration, and stress‐migration on the basis of entropy production.