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Library of Congress Cataloging‐in‐Publication Data

Names: Tu, K. N. (King‐Ning), 1937– author. | Chen, Chih, 1970– author. | Chen, Hung‐Ming, author.

Title: Electronic packaging science and technology / King‐Ning Tu, University of California, Los Angeles, United States of America; Chih Chen, National Chiao Tung University, Hsinchu, Taiwain; Hung‐Ming Chen, National Chiao Tung University, Hsinchu, Taiwain.

Description: 1st edition. | Hoboken, NJ : Wiley, 2022. | Includes bibliographical references and index.

Identifiers: LCCN 2021039114 (print) | LCCN 2021039115 (ebook) | ISBN 9781119418313 (cloth) | ISBN 9781119418320 (adobe pdf) | ISBN 9781119418337 (epub)

Classification: LCC TK7870.15 .T8 2022 (print) | LCC TK7870.15 (ebook) | DDC 621.381/046–dc23

LC record available at https://lccn.loc.gov/2021039114 LC ebook record available at https://lccn.loc.gov/2021039115

Cover image: © Andriy Onufriyenko/Getty Images

Cover design by Wiley

As we enter the big data era, mobile devices are ubiquitous. Internet of things (IoT) is everywhere, and we have man‐to‐man, man‐to‐machine, and machine‐to‐machine communications. Furthermore, in the Covid‐19 virus pandemic period, the trend of distance teaching, distance medicine, home office, and on‐line meeting has increased greatly the need of advanced consumer electronic products, demanding smaller form factor, larger memory, more functions, faster and larger data collection and transmission, cheaper cost, and superb reliability. At the same time, 5G advanced communication technology and 3D IC devices have begun their impact to our society, and many new artificial intelligence (AI) applications have been invented.