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With the perceived slowing down of Moore’s law of miniaturization of Si chip technology, microelectronic industry is searching for alternative ways to sustain Moore’s law. 3D IC is most promising in achieving more‐than‐Moore, wherein the up‐scale of packaging technology is critical. Indeed, new advanced packaging factories are being built worldwide. We ask what will be the technical innovations in electronic packaging for 3D IC devices in order to enhance performance and reliability? Or, what are the challenging issues in electronic packaging technology that are essential in the near future development of semiconductor technology?

The goal of this book to present the science and engineering of advanced electronic packaging technology for a deeper understanding of the essence in development and manufacturing of the more‐than‐Moore technology. Especially, what is new in this book are the subjects of Cu‐to‐Cu direct bonding by using the (111) uni‐directionally oriented nanotwin Cu, innovative 3D IC systems in packaging integration for high performance of wide bandwidth and low power devices, and the analysis of mean‐time‐to‐failure equations based on entropy production.