Читать книгу Electronic Packaging Science and Technology онлайн
5 страница из 38
11 Chapter 11Figure 11.1 We shall consider J in the equation between two points; point 1 ...Figure 11.2 The temperature distribution on the cross‐section of a solder jo...Figure 11.3 (a) Schematic diagram of a row of four composite solders, in whi...
12 Chapter 12Figure 12.1 (a) The deposition of an Al thin film on a thick quartz substrat...Figure 12.2 (a) It shows that the stresses act along the two principal axes ...Figure 12.3 (a) We have enlarged one end of the substrate to show the neutra...Figure 12.4 A hexagonal grain in a polycrystalline solid is under a shear st...Figure 12.5 (a) SEM image of a Sn whisker between two Cu bumps having a top ...Figure 12.6 (a) SEM image of Sn whiskers on a lead‐frame surface. (b) A shor...Figure 12.7 Both (a) and (b) are electron diffraction pattern and cross‐sect...Figure 12.8 A cross‐sectional view of a whisker on a bilayer of Sn/Cu. A cra...Figure 12.9 SEM image of a Sn whisker on a leg of lead‐frame indicated by a ...Figure 12.10 Synchrotron radiation micro‐diffraction was used to measure the...Figure 12.11 The measured distribution of compressive stress in the surround...Figure 12.12 To model the whisker growth, we assume an array of them, each h...Figure 12.13 A set of four SEM images of the initiation and growth of a Sn w...