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No doubt, 5G technology will enhance AI applications. At the end of this book, in ssss1, we shall discuss the need of using AI to accelerate the study of reliability, so that we may change it from a time‐dependent event to a time‐independent event. Another area for the use of AI will be the biomedical and health applications. For example, Chinese medicine has been based on big data for many years, and the technique of acupuncture could be improved with modern microelectronic devices. The link between microelectronics and biomedical applications will be the most important advanced technology in the future.

As the trend of miniaturization in Si technology slows down, microelectronics industry has been looking for ways to keep the downsizing momentum going, meaning to go to more‐than‐Moore! [1–3] The critical feature size in Si devices has already reached nanoscale, below 10 nm. Hence, it is harder and harder to make transistor circuits on a Si chip smaller and smaller without a large cost increase. At present, the most promising way to extend Moore’s law is to go from 2D IC to 3D IC. Actually, the paradigm change has occurred more than 10 years ago, but 3D IC is not in mass production, because of cost and reliability.